Component dosage /g component dosage /g
E-44 Epoxy 100 MS-2 Microcapsule 1 50
JLY-121 polysulfide rubber 10 Â Â
14,4-Diaminodiphenylmethane and polyvinyl formal, the outer layer of polyvinyl alcohol film.
Preparation and curing  When used, the capsules are broken and mixed with the other ingredients in amounts. Curing for 2 h at 130 °C.
use  The glue is solvent-free, odorless, and the use temperature is not higher than 100°C. Mainly used for aluminum, steel, iron and other materials, suitable for bonding potentiometer, wire wound resistance coil and base.