First, the introduction
With the rapid development of rail transit in China, the AFC-based charging model has been widely accepted and adopted. However, with the development of electronic technology and the rise of non-contact IC cards, the shortcomings of AFC systems that charge magnetic cards have become increasingly prominent. The main performances are: poor confidentiality of the magnetic card, small capacity, complicated structure of the entrance and exit ticket checking machine, etc., so that the entire AFC system is expensive to invest and the maintenance cost is relatively high. To this end, operators are deeply embarrassed and urgently need a new product to replace the existing magnetic card. The new product requirements have the advantages of large storage capacity, high confidentiality, simple structure of the corresponding reading and writing implements, and convenient maintenance; at the same time, the thickness of the magnetic card is maintained, and the advantages of flexible transmission are satisfied. Based on these requirements, we believe that the standard non-contact IC card can meet some of the requirements, but because its thickness is about 0.8mm, and it is only suitable for occasions where no bending is required, such as bus card. Therefore, in order to make the standard non-contact IC card meet the requirements of flexible transmission, it is necessary to reduce the thickness of the card body while maintaining the advantages of the non-contact IC card. A thin contactless IC card is a new product that emerges under this demand.
2. Analysis and selection of components in thin non-contact IC cards
The composition of the thin non-contact IC card is the same as that of the standard non-contact IC card, and is composed of a chip, a card-based material, an antenna, and the like, but there are also differences depending on the specific use. They are discussed separately as follows:
1. Choice of chip package form
Conventional non-contact IC card production is formally produced by molding a packaged module in a chip package. If a thin non-contact IC card is to be produced, the difficulty is large when a module size of 4.8 mm × 5.1 mm × 0.30 mm is used. Therefore, it is necessary to use a smaller package of unpackaged bare chips. For example, Philips' ultralight bare chip has an outer dimension of about 0.55 mm × 0.55 mm × 0.13 mm. Since its thickness is only 0.13 mm, it is a thin non-contact IC card. Created a favorable condition.
(1) The main production process of the module package (as shown in Figure 1): The production process is generally completed by the module packaging factory. Since the following production steps are added in the process, the production cost is obviously higher than that of the module package and the bare chip package, and the thickness of the module is also much thicker than that of the bare chip, and only the glue is sealed. The thickness is about 0.3mm.
(2) In order to analyze the difference between the two forms in more detail, the following is a brief introduction through the structural diagram. Figures 2a and 2b show the structural comparison of the module package and the flip-chip connection (FLIP CHIP). As can be seen from the figure, the module package structure is more complicated than the flip-chip connection. In Figure 2a, the substrate connected to the gold wire is generally the pin of the chip. In the production, the packaged module needs to be punched from the carrier tape and then soldered to the two contacts of the wound antenna. To complete the circuit part of the non-contact IC card. When the flip-chip connection technology is used, as shown in FIG. 2b, the substrate may be a contact of an etched antenna (or a printed antenna), which eliminates the module packaging process of FIG. 1 and does not need to be punched from the carrier tape. Production processes such as modules and bump welding. Moreover, the direct connection between the pad and the pad can be realized, and the stray capacitance, interconnection resistance and interconnection inductance generated by the interconnection are reduced. The production process is simplified and the reliability of the non-contact IC card is improved. At the same time, due to the use of chip direct connection technology, the produced in-layer (inlay) can generally be controlled within 0.26 mm in thickness, which lays a good foundation for the production of non-contact IC cards with a thickness of 0.5 mm.
In Fig. 2b, if the substrate is not an etched antenna (or a printed antenna) but a carrier tape, such a structural form is the FCP form, and with this configuration, an antenna layer having a thickness of 0.26 mm can also be produced.
(3) Flip-chip connection is a new interconnect technology, which has a wide range of applications in the semiconductor industry. Although the flip chip technology used in the production of non-contact IC cards (the case where the substrate is an antenna contact in Fig. 2b) is from the semiconductor industry, there are still some major differences. Table 1 briefly lists some of the differences between the application of flip-chip technology in the production of contactless IC cards and the semiconductor industry. As can be seen from the table, for the specific case of the non-contact IC card, the flip-chip connection process has its own characteristics, which is considered according to the characteristics of the substrate and the type of the chip.
According to the above analysis, the module of the molded package is relatively large in size, and it is not suitable for producing a non-contact IC card having a thickness of 0.5 mm or less, and the flip-chip process is a very mature technology. The technology can produce thinner non-contact IC cards (thickness can even reach 0.4mm or thinner). At the same time, the flip chip process is also one of the future development directions of the IC card industry.
2. Selection of card base materials
At present, the card-based materials used in the production of non-contact IC cards are generally PVC, PET, paper, etc. The following describes the characteristics and applications of these materials:
(1) PVC (scientific name polyvinyl chloride) is a commonly used material in the production of non-contact IC cards. Its softening point (Vicat) is generally between 50 and 700 °C. The thermal temperature of PVC is slightly poorer. When it is heated to above 1300 °C, it begins to liberate toxic hydrogen chloride, which will rapidly decompose and carbonize at around 2000 °C. Therefore, in the process parameters of conventional production, the temperature is generally controlled within 1700 ° C. Because of the proper heating and pressurization of this material, several layers of PVC can be completely integrated into one. Therefore, this material has been widely used in the industry of non-contact IC cards. It is also feasible to use this material to produce a one-way ticket. However, because the strength and wear resistance of PVC are not as good as PET, it is not as thin as the magnetic card (PET material) in the thickness of the card. Generally, the thickness of the PVC card is more than 0.3 mm, and most preferably 0.4 mm or more. Only to ensure sufficient strength and wear resistance.
(2) PET (scientific name polyethylene terephthalate), softening range of 230 ~ 240 ° C, melting point of 255 ~ 260 ° C, with better bending and wear resistance. However, under the current technical conditions, it is not possible to fuse several layers of PET cards into one whole by heating and pressing like a PVC card. Therefore, in most cases, double-sided tape is used as a bonding material to solve this problem. There are also manufacturers that use relatively high-temperature thermosetting adhesives as bonding materials, but this will increase the cost of the product. At the same time, if PET is used to produce a one-way ticket, when the process parameters for producing a non-contact IC card are used in the lamination process, it is not possible to soften the extension to fill the gap like PVC. Therefore, even if the thickness of the card base after lamination can reach 0.4 mm or less, the thickness of the chip position therein is still much larger than this value.
(3) As a material for producing non-contact IC cards, paper is relatively cheap, and is generally used to produce electronic labels. If it is used as a one-way ticket, it is necessary to solve problems such as moisture resistance and card strength.
According to the currently used card base material, it can be seen from the above analysis that although PET and paper each have certain advantages, the material which is ideal for producing a one-way ticket is PVC.
3. Selection of antenna types
The types of antennas used in non-contact IC cards (including electronic tags) generally include a wound antenna, an etched antenna, and a printed antenna. Most of the traditional non-contact IC cards use a wound antenna, and a few use an etched antenna. The experimental results show that the etched antenna has stable performance and is technically mature. The printed antenna is made by screen printing using conductive silver paste. The antenna has the disadvantage that the coil resistance value will change when the antenna is bent. The one-way ticket produced by the antenna generally generates a signal when the card is issued. Stable situation (usually there are about 2 to 4 out of 100, and the proportion is 2~4%). Such screen printed antennas are commonly used in electronic tags. In addition, the wound antenna can only be wound on PVC substrates; the etched antenna can be made on both PVC and PET materials; and the printed antenna can be printed on these three materials.
Second, the current habits of passengers when using the ticket card
The above analysis of the main components of the non-contact IC card is made for the reference of manufacturers of R&D and production of thin contactless IC cards. Considering the specific use environment of this new thin non-contact IC card in rail transit, that is, the passengers should use the ticket when riding the car. After observation and statistics, it was found that:
When passengers are on the bus, most of them will keep the ticket cards in their pockets and other places for use when they are out of the station. However, there are also many people who have kept the ticket card in their hands when they are in the car, so that they can do some actions on the ticket card intentionally or unintentionally. These actions can generally be summarized as follows:
a. Sweat. This situation is especially noticeable in the summer. They use the ticket card as a tool to remove some of the sweat from the face and hands. This requires the ticket card itself to have moisture-proof ability, and the paper ticket card is difficult to meet. This requirement.
b. Tick your nails. Some people have the habit of keeping long nails. When you are riding a car, you may use a ticket card to pick up your nails. If the layers of the ticket are glued together, the nails will be easy to put the layers of the ticket. Stripped open, resulting in a waste card.
c. Bend the ticket card. Since there is usually nothing to do when riding a car, when holding a ticket card in hand, it is possible to temporarily use the ticket card as a tool for killing time and do some twisting and twisting on it. At present, when a magnetic card is used, it will be ejected, and if the strength of the ticket is not high enough, the ticket may be damaged and scrapped. If the thin non-contact IC card of the module package is used as the ticket card, the PVC layer of the module position is thin, and it is more likely to damage the module and the card is scrapped.
The above points may be the situation that people may appear when riding a car. Some of the actions may cause damage to the ticket card much more than normal use, and even cause one of the direct causes of the ticket card scrapping. Therefore, the manufacturer of the ticket card has put forward higher requirements, that is, it must meet the various technical requirements of the ticket card in normal use, and also take into account various bad habits when people are riding. Only in this way can we ensure that the product ticket card has a good price/performance ratio.
in conclusion
Through the analysis of the components of the non-contact IC card, it can be known that the magnetic ticket card used in the AFC of the rail transit automatic toll collection system can be replaced by the flip chip technology, the PVC lamination process, the antenna using the wound antenna or the etching. Thin contactless IC card produced by the antenna. With the further development of rail transit, it is believed that this new product will certainly be more developed and applied.
With the rapid development of rail transit in China, the AFC-based charging model has been widely accepted and adopted. However, with the development of electronic technology and the rise of non-contact IC cards, the shortcomings of AFC systems that charge magnetic cards have become increasingly prominent. The main performances are: poor confidentiality of the magnetic card, small capacity, complicated structure of the entrance and exit ticket checking machine, etc., so that the entire AFC system is expensive to invest and the maintenance cost is relatively high. To this end, operators are deeply embarrassed and urgently need a new product to replace the existing magnetic card. The new product requirements have the advantages of large storage capacity, high confidentiality, simple structure of the corresponding reading and writing implements, and convenient maintenance; at the same time, the thickness of the magnetic card is maintained, and the advantages of flexible transmission are satisfied. Based on these requirements, we believe that the standard non-contact IC card can meet some of the requirements, but because its thickness is about 0.8mm, and it is only suitable for occasions where no bending is required, such as bus card. Therefore, in order to make the standard non-contact IC card meet the requirements of flexible transmission, it is necessary to reduce the thickness of the card body while maintaining the advantages of the non-contact IC card. A thin contactless IC card is a new product that emerges under this demand.
2. Analysis and selection of components in thin non-contact IC cards
The composition of the thin non-contact IC card is the same as that of the standard non-contact IC card, and is composed of a chip, a card-based material, an antenna, and the like, but there are also differences depending on the specific use. They are discussed separately as follows:
1. Choice of chip package form
Conventional non-contact IC card production is formally produced by molding a packaged module in a chip package. If a thin non-contact IC card is to be produced, the difficulty is large when a module size of 4.8 mm × 5.1 mm × 0.30 mm is used. Therefore, it is necessary to use a smaller package of unpackaged bare chips. For example, Philips' ultralight bare chip has an outer dimension of about 0.55 mm × 0.55 mm × 0.13 mm. Since its thickness is only 0.13 mm, it is a thin non-contact IC card. Created a favorable condition.
(1) The main production process of the module package (as shown in Figure 1): The production process is generally completed by the module packaging factory. Since the following production steps are added in the process, the production cost is obviously higher than that of the module package and the bare chip package, and the thickness of the module is also much thicker than that of the bare chip, and only the glue is sealed. The thickness is about 0.3mm.
(2) In order to analyze the difference between the two forms in more detail, the following is a brief introduction through the structural diagram. Figures 2a and 2b show the structural comparison of the module package and the flip-chip connection (FLIP CHIP). As can be seen from the figure, the module package structure is more complicated than the flip-chip connection. In Figure 2a, the substrate connected to the gold wire is generally the pin of the chip. In the production, the packaged module needs to be punched from the carrier tape and then soldered to the two contacts of the wound antenna. To complete the circuit part of the non-contact IC card. When the flip-chip connection technology is used, as shown in FIG. 2b, the substrate may be a contact of an etched antenna (or a printed antenna), which eliminates the module packaging process of FIG. 1 and does not need to be punched from the carrier tape. Production processes such as modules and bump welding. Moreover, the direct connection between the pad and the pad can be realized, and the stray capacitance, interconnection resistance and interconnection inductance generated by the interconnection are reduced. The production process is simplified and the reliability of the non-contact IC card is improved. At the same time, due to the use of chip direct connection technology, the produced in-layer (inlay) can generally be controlled within 0.26 mm in thickness, which lays a good foundation for the production of non-contact IC cards with a thickness of 0.5 mm.
In Fig. 2b, if the substrate is not an etched antenna (or a printed antenna) but a carrier tape, such a structural form is the FCP form, and with this configuration, an antenna layer having a thickness of 0.26 mm can also be produced.
(3) Flip-chip connection is a new interconnect technology, which has a wide range of applications in the semiconductor industry. Although the flip chip technology used in the production of non-contact IC cards (the case where the substrate is an antenna contact in Fig. 2b) is from the semiconductor industry, there are still some major differences. Table 1 briefly lists some of the differences between the application of flip-chip technology in the production of contactless IC cards and the semiconductor industry. As can be seen from the table, for the specific case of the non-contact IC card, the flip-chip connection process has its own characteristics, which is considered according to the characteristics of the substrate and the type of the chip.
According to the above analysis, the module of the molded package is relatively large in size, and it is not suitable for producing a non-contact IC card having a thickness of 0.5 mm or less, and the flip-chip process is a very mature technology. The technology can produce thinner non-contact IC cards (thickness can even reach 0.4mm or thinner). At the same time, the flip chip process is also one of the future development directions of the IC card industry.
2. Selection of card base materials
At present, the card-based materials used in the production of non-contact IC cards are generally PVC, PET, paper, etc. The following describes the characteristics and applications of these materials:
(1) PVC (scientific name polyvinyl chloride) is a commonly used material in the production of non-contact IC cards. Its softening point (Vicat) is generally between 50 and 700 °C. The thermal temperature of PVC is slightly poorer. When it is heated to above 1300 °C, it begins to liberate toxic hydrogen chloride, which will rapidly decompose and carbonize at around 2000 °C. Therefore, in the process parameters of conventional production, the temperature is generally controlled within 1700 ° C. Because of the proper heating and pressurization of this material, several layers of PVC can be completely integrated into one. Therefore, this material has been widely used in the industry of non-contact IC cards. It is also feasible to use this material to produce a one-way ticket. However, because the strength and wear resistance of PVC are not as good as PET, it is not as thin as the magnetic card (PET material) in the thickness of the card. Generally, the thickness of the PVC card is more than 0.3 mm, and most preferably 0.4 mm or more. Only to ensure sufficient strength and wear resistance.
(2) PET (scientific name polyethylene terephthalate), softening range of 230 ~ 240 ° C, melting point of 255 ~ 260 ° C, with better bending and wear resistance. However, under the current technical conditions, it is not possible to fuse several layers of PET cards into one whole by heating and pressing like a PVC card. Therefore, in most cases, double-sided tape is used as a bonding material to solve this problem. There are also manufacturers that use relatively high-temperature thermosetting adhesives as bonding materials, but this will increase the cost of the product. At the same time, if PET is used to produce a one-way ticket, when the process parameters for producing a non-contact IC card are used in the lamination process, it is not possible to soften the extension to fill the gap like PVC. Therefore, even if the thickness of the card base after lamination can reach 0.4 mm or less, the thickness of the chip position therein is still much larger than this value.
(3) As a material for producing non-contact IC cards, paper is relatively cheap, and is generally used to produce electronic labels. If it is used as a one-way ticket, it is necessary to solve problems such as moisture resistance and card strength.
According to the currently used card base material, it can be seen from the above analysis that although PET and paper each have certain advantages, the material which is ideal for producing a one-way ticket is PVC.
3. Selection of antenna types
The types of antennas used in non-contact IC cards (including electronic tags) generally include a wound antenna, an etched antenna, and a printed antenna. Most of the traditional non-contact IC cards use a wound antenna, and a few use an etched antenna. The experimental results show that the etched antenna has stable performance and is technically mature. The printed antenna is made by screen printing using conductive silver paste. The antenna has the disadvantage that the coil resistance value will change when the antenna is bent. The one-way ticket produced by the antenna generally generates a signal when the card is issued. Stable situation (usually there are about 2 to 4 out of 100, and the proportion is 2~4%). Such screen printed antennas are commonly used in electronic tags. In addition, the wound antenna can only be wound on PVC substrates; the etched antenna can be made on both PVC and PET materials; and the printed antenna can be printed on these three materials.
Second, the current habits of passengers when using the ticket card
The above analysis of the main components of the non-contact IC card is made for the reference of manufacturers of R&D and production of thin contactless IC cards. Considering the specific use environment of this new thin non-contact IC card in rail transit, that is, the passengers should use the ticket when riding the car. After observation and statistics, it was found that:
When passengers are on the bus, most of them will keep the ticket cards in their pockets and other places for use when they are out of the station. However, there are also many people who have kept the ticket card in their hands when they are in the car, so that they can do some actions on the ticket card intentionally or unintentionally. These actions can generally be summarized as follows:
a. Sweat. This situation is especially noticeable in the summer. They use the ticket card as a tool to remove some of the sweat from the face and hands. This requires the ticket card itself to have moisture-proof ability, and the paper ticket card is difficult to meet. This requirement.
b. Tick your nails. Some people have the habit of keeping long nails. When you are riding a car, you may use a ticket card to pick up your nails. If the layers of the ticket are glued together, the nails will be easy to put the layers of the ticket. Stripped open, resulting in a waste card.
c. Bend the ticket card. Since there is usually nothing to do when riding a car, when holding a ticket card in hand, it is possible to temporarily use the ticket card as a tool for killing time and do some twisting and twisting on it. At present, when a magnetic card is used, it will be ejected, and if the strength of the ticket is not high enough, the ticket may be damaged and scrapped. If the thin non-contact IC card of the module package is used as the ticket card, the PVC layer of the module position is thin, and it is more likely to damage the module and the card is scrapped.
The above points may be the situation that people may appear when riding a car. Some of the actions may cause damage to the ticket card much more than normal use, and even cause one of the direct causes of the ticket card scrapping. Therefore, the manufacturer of the ticket card has put forward higher requirements, that is, it must meet the various technical requirements of the ticket card in normal use, and also take into account various bad habits when people are riding. Only in this way can we ensure that the product ticket card has a good price/performance ratio.
in conclusion
Through the analysis of the components of the non-contact IC card, it can be known that the magnetic ticket card used in the AFC of the rail transit automatic toll collection system can be replaced by the flip chip technology, the PVC lamination process, the antenna using the wound antenna or the etching. Thin contactless IC card produced by the antenna. With the further development of rail transit, it is believed that this new product will certainly be more developed and applied.
Household Scissors can be used for a range of uses in the home including crafts, food preparation and gardening. Whether you are preparing food, sewing, working in your garage or crafting with your kids, we have the perfect pair of household scissors for you. You may have several scissors depending on the activities you use them for. They are used for cutting various materials such as paper, thin plastic, cardboard, metal foil, cloth, rope, wire, hair, and food. Our household scissors are loved for their superior cutting performance and legendary durability.
Household Scissors
Household Scissors,Fabric Scissors,Safety Scissors,Plastic Scissors
Yangjiang Superwins Trade Co., Ltd. , http://www.superwins-kitchenware.com